Published 2026-06-28 · Updated 2026-08-28 · Reviewed by VeriPCB engineering content team

Data consistency

Confirm that Gerber, drill, BOM, centroid and assembly drawings share the same revision and coordinate origin. Remove obsolete files from the release package.

Footprints and polarity

Check land patterns against component datasheets, especially thermal pads, pin-one marks, polarized parts, fine pitch and connector orientation.

Panel and process access

Review rails, tooling holes, fiducials, breakaway method, component-to-edge clearance and access for wave or selective solder.

Thermal and solder risks

Identify large copper imbalances, heat-sensitive parts, mixed component scales, via-in-pad and components likely to require special stencil or profile treatment.

Inspection and test access

Provide visible reference designators, test points, programming interfaces, expected voltages and a functional-test procedure with explicit limits.

Use this guide in your RFQ

Ask suppliers to answer these points against your actual build package and record assumptions in the quotation.

Prepare an RFQ