Verified PCB & PCBA manufacturingVisual inspection and AOI
Visual methods detect placement, polarity and visible solder defects. AOI provides repeatable optical coverage but cannot see hidden joints beneath bottom-terminated packages.
X-ray inspection
X-ray reveals hidden solder features under BGA, QFN and similar packages. Sampling or full coverage should be decided according to package, process maturity and risk.
ICT and flying probe
Electrical structural tests can identify opens, shorts and component-value errors when test access and circuit design permit. Fixture economics matter for lower volumes.
Functional testing
FCT checks product behavior against defined inputs and outputs. The customer must define pass criteria, firmware, fixture interfaces and safe operating conditions.
Create a coverage matrix
Map critical failure modes to the method capable of detecting them. Record gaps instead of claiming an undefined percentage of test coverage.
Use this guide in your RFQ
Ask suppliers to answer these points against your actual build package and record assumptions in the quotation.
Prepare an RFQ